Asheghi, Mehdi: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

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Підтримати

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Статті (149)
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Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Lee, Hyoungsoon, Maitra, Tanmoy, Palko, James, Kong, Daeyoung, Zhang, Chi, Barako, Michael T., Won, Yoonjin, Asheghi, Mehdi, Goodson, Kenneth E.

Журнал:

Journal of Electronic Packaging

Рік:

2018

Мова:

english

Файл:

PDF, 1.23 MB

english, 2018

Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics

Won, Yoonjin, Cho, Jungwan, Agonafer, Damena, Asheghi, Mehdi, Goodson, Kenneth E.

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2015

Мова:

english

Файл:

PDF, 2.55 MB

english, 2015

Energy-Efficient Abundant-Data Computing: The N3XT 1,000x

Sabry Aly, Mohamed M., Gao, Mingyu, Hills, Gage, Lee, Chi-Shuen, Pitner, Greg, Shulaker, Max M., Wu, Tony F., Asheghi, Mehdi, Bokor, Jeff, Franchetti, Franz, Goodson, Kenneth E., Kozyrakis, Christos,

Журнал:

Computer

Рік:

2015

Мова:

english

Файл:

PDF, 4.27 MB

english, 2015

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Heat Transfer Enhancement in the Heat Sinks for Electronic Cooling Applications

Small, Evan, Sadeghipour, Sadegh M., Asheghi, Mehdi

Рік:

2005

Мова:

english

Файл:

PDF, 431 KB

english, 2005

Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

Jung, Ki Wook, Kharangate, Chirag R., Lee, Hyoungsoon, Palko, James, Zhou, Feng, Asheghi, Mehdi, Dede, Ercan M., Goodson, Kenneth E.

Журнал:

International Journal of Heat and Mass Transfer

Рік:

2019

Мова:

english

Файл:

PDF, 2.68 MB

english, 2019

Thermal property measurement of thin aluminum oxide layers for giant magnetoresistive (GMR) head applications

Bahareh Behkam, Yizhang Yang, Mehdi Asheghi

Журнал:

International Journal of Heat and Mass Transfer

Рік:

2005

Мова:

english

Файл:

PDF, 515 KB

english, 2005

Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications

Cho, Jungwan, Li, Zijian, Bozorg-Grayeli, Elah, Kodama, Takashi, Francis, Daniel, Ejeckam, Felix, Faili, Firooz, Asheghi, Mehdi, Goodson, Kenneth E.

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2013

Мова:

english

Файл:

PDF, 1.05 MB

english, 2013

Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications

Small, Evan, Sadeghipour, Sadegh M., Asheghi, Mehdi

Журнал:

Journal of Electronic Packaging

Рік:

2006

Мова:

english

Файл:

PDF, 837 KB

english, 2006

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries

Agonafer, Damena D., Lopez, Ken, Yoonjin Won,, Palko, James, Asheghi, Mehdi, Santiago, Juan G., Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 4.28 MB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal conduction normal to thin silicon nitride films on diamond and GaN

Cho, Jungwan, Chu, Kenneth K., Chao, Pane C., McGray, Craig, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 498 KB

english, 2014

Nanoscale Calorimetry Using a Suspended Bridge Configuration

Zhang, Shu, Rabin, Yoed, Yang, Yizhang, Asheghi, Mehdi

Журнал:

Journal of Microelectromechanical Systems

Рік:

2007

Мова:

english

Файл:

PDF, 908 KB

english, 2007

Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications

Barako, Michael T., Gao, Yuan, Won, Yoonjin, Marconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2014

Мова:

english

Файл:

PDF, 1.45 MB

english, 2014

Power density optimization for micro thermoelectric generators

Dunham, Marc T., Barako, Michael T., LeBlanc, Saniya, Asheghi, Mehdi, Chen, Baoxing, Goodson, Kenneth E.

Журнал:

Energy

Рік:

2015

Мова:

english

Файл:

PDF, 2.15 MB

english, 2015

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Numerical Modeling of Heat Transfer and Phase Transition in Programming the Ovonic Unified Memory Cells

Small, Evan, Sadeghipour, Sadegh M., Asheghi, Mehdi

Рік:

2005

Мова:

english

Файл:

PDF, 357 KB

english, 2005

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 1 - Investigation of the Accuracy and Spatial Resolution of Scanning Thermal Microscopy (SThM) Technique

Lo, Hsinyi, Liu, Wenjun, Asheghi, Mehdi

Рік:

2005

Мова:

english

Файл:

PDF, 373 KB

english, 2005

Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices

Cornett, Jane, Chen, Baoxing, Haidar, Samer, Berney, Helen, McGuinness, Pat, Lane, Bill, Gao, Yuan, He, Yifan, Sun, Nian, Dunham, Marc, Asheghi, Mehdi, Goodson, Ken, Yuan, Yi, Najafi, Khalil

Журнал:

Journal of Electronic Materials

Рік:

2017

Мова:

english

Файл:

PDF, 1.11 MB

english, 2017

Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films

Dunham, Marc T., Lorenzi, Bruno, Andrews, Sean C., Sood, Aditya, Asheghi, Mehdi, Narducci, Dario, Goodson, Kenneth E.

Журнал:

Applied Physics Letters

Рік:

2016

Мова:

english

Файл:

PDF, 545 KB

english, 2016

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 3 - Numerical Simulation of Mark Formation/Erasure in Phase Change Recording

Small, Evan, Reifenberg, John, Yang, Yizhang, Sadeghipour, Sadegh M., Asheghi, Mehdi

Рік:

2005

Мова:

english

Файл:

PDF, 463 KB

english, 2005

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - A Novel Scheme in Thermal Modeling of Printed Circuit Boards

Liu, Wenjun, Lee, Min-Young, Shabany, Younes, Asheghi, Mehdi

Рік:

2005

Мова:

english

Файл:

PDF, 661 KB

english, 2005

Special Section on InterPACK 2015

Chaparala, Satish, Gupta, Ashish, Asheghi, Mehdi, Suhling, Jeffrey, Ikeda, Toru, Luo, Xiaobing

Журнал:

Journal of Electronic Packaging

Рік:

2016

Мова:

english

Файл:

PDF, 79 KB

english, 2016

Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique

Sadeghipour, Sadegh M., Asheghi, Mehdi

Журнал:

Journal of Electronic Packaging

Рік:

2006

Мова:

english

Файл:

PDF, 425 KB

english, 2006

Experimental investigation of embedded micro-pin-fins for single-phase heat transfer and pressure drop

Kharangate, Chirag, Jung, Ki Wook, Jung, SangWoo, Kong, Daeyoung, Schaadt, Joseph, Iyengar, Madhusudan, Malone, Christopher G., Lee, Hyoungsoon, Asheghi, Dr. Mehdi, Goodson, Kenneth

Журнал:

Journal of Electronic Packaging

Рік:

2018

Мова:

english

Файл:

PDF, 5.68 MB

english, 2018

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 4 - Thermal Conduction in Ultra-Thin Pure and Doped Single Crystal Silicon Layers at High Temperatures

Liu, Wenjun, Asheghi, Mehdi

Рік:

2005

Мова:

english

Файл:

PDF, 401 KB

english, 2005

[IEEE 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - San Antonio, TX, USA (2018.3.4-2018.3.8)] 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - Modular heat sink for chip-scale GaN transistors in multilevel converters

Pallo, Nathan, Kharangate, Chirag, Modeer, Tomas, Schaadt, Joseph, Asheghi, Mehdi, Goodson, Kenneth, Pilawa-Podgurski, Robert

Рік:

2018

Мова:

english

Файл:

PDF, 2.21 MB

english, 2018

Impact of thermally dead volume on phonon conduction along silicon nanoladders

Park, Woosung, Sohn, Joon, Romano, Giuseppe, Kodama, Takashi, Sood, Aditya, Katz, Joseph S., Kim, Brian S. Y., So, Hongyun, Ahn, Ethan C., Asheghi, Mehdi, Kolpak, Alexie M., Goodson, Kenneth E.

Журнал:

Nanoscale

Рік:

2018

Мова:

english

Файл:

PDF, 1.19 MB

english, 2018

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - The Heat Conduction Renaissance

Sood, Aditya, Pop, Eric, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2018

Мова:

english

Файл:

PDF, 112 KB

english, 2018

[IEEE 2018 IEEE Symposium on VLSI Technology - Honolulu, HI (2018.6.18-2018.6.22)] 2018 IEEE Symposium on VLSI Technology - Thermal Management Research – from Power Electronics to Portables

Jung, Ki Wook, Zhang, Chi, Liu, Tanya, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2018

Мова:

english

Файл:

PDF, 2.79 MB

english, 2018

Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa

Kong, Daeyoung, Jung, Ki Wook, Jung, Sangwoo, Jung, Daewoong, Schaadt, Joseph, Iyengar, Madhusudan, Malone, Chris, Kharangate, Chirag R., Asheghi, Mehdi, Goodson, Kenneth E., Lee, Hyoungsoon

Журнал:

International Journal of Heat and Mass Transfer

Рік:

2019

Мова:

english

Файл:

PDF, 2.11 MB

english, 2019

[IEEE 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - Anaheim, CA, USA (2019.3.17-2019.3.21)] 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - A Compact 50-kW Traction Inverter Design Using Off-the-Shelf Components

Alizadeh, Rana, Adamson, Tyler, Balda, Juan Carlos, Zhao, Yue, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2019

Мова:

english

Файл:

PDF, 2.72 MB

english, 2019

Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm

Li, Zijian, Tan, Si, Bozorg-Grayeli, Elah, Kodama, Takashi, Asheghi, Mehdi, Delgado, Gil, Panzer, Matthew, Pokrovsky, Alexander, Wack, Daniel, Goodson, Kenneth E.

Журнал:

Nano Letters

Рік:

2012

Мова:

english

Файл:

PDF, 533 KB

english, 2012

Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics

Bozorg-Grayeli, Elah, Li, Zijian, Asheghi, Mehdi, Delgado, Gil, Pokrovsky, Alexander, Panzer, Matthew, Wack, Daniel, Goodson, Kenneth E.

Журнал:

Journal of Applied Physics

Рік:

2012

Мова:

english

Файл:

PDF, 1.27 MB

english, 2012

Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling

Lee, Jaeho, Asheghi, Mehdi, Goodson, Kenneth E

Журнал:

Nanotechnology

Рік:

2012

Мова:

english

Файл:

PDF, 1.46 MB

english, 2012

Thermal Conductivity Measurements of Ultra-Thin Single Crystal Silicon Layers

Liu, Wenjun, Asheghi, Mehdi

Журнал:

Journal of Heat Transfer

Рік:

2006

Мова:

english

Файл:

PDF, 662 KB

english, 2006

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Effect of thermal cycling on commercial thermoelectric modules

Woosung Park,, Barako, Michael T., Marconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2012

Мова:

english

Файл:

PDF, 1.45 MB

english, 2012

Impact of Annealing on the Thermoelectric Properties of Ge2Sb2Te5 Films

Lee, Jaeho, Kodama, Takashi, Won, Yoonjin, Asheghi, Mehdi, Goodson, Kenneth E.

Журнал:

MRS Proceedings

Рік:

2013

Мова:

english

Файл:

PDF, 278 KB

english, 2013

From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology

Marconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.

Журнал:

Journal of Heat Transfer

Рік:

2013

Мова:

english

Файл:

PDF, 1.39 MB

english, 2013

[IEEE 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) - Monterey, CA, USA (2013.10.13-2013.10.16)] 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) - Cooling Limits for GaN HEMT Technology

Won, Yoonjin, Cho, Jungwan, Agonafer, Damena, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2013

Мова:

english

Файл:

PDF, 320 KB

english, 2013

[IEEE 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) - La Jolla, CA, USA (2012.10.14-2012.10.17)] 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) - Temperature Dependent Thermal Resistances at GaN-Substrate Interfaces in GaN Composite Substrates

Cho, Jungwan, Li, Yiyang, Altman, David H., Hoke, William E., Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2012

Мова:

english

Файл:

PDF, 860 KB

english, 2012

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Solder-bonded carbon nanotube thermal interface materials

Barako, Michael T., Gao, Yuan, Marconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2012

Мова:

english

Файл:

PDF, 900 KB

english, 2012

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films

Marconnet, Amy M., Motoyama, Munekazu, Barako, Michael T., Yuan Gao,, Pozder, Scott, Fowler, Burt, Ramakrishna, Koneru, Mortland, Glenn, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2012

Мова:

english

Файл:

PDF, 837 KB

english, 2012

Ultrafast Characterization of Phase-Change Material Crystallization Properties in the Melt-Quenched Amorphous Phase

Jeyasingh, Rakesh, Fong, Scott W., Lee, Jaeho, Li, Zijian, Chang, Kuo-Wei, Mantegazza, Davide, Asheghi, Mehdi, Goodson, Kenneth E., Wong, H.-S. Philip

Журнал:

Nano Letters

Рік:

2014

Мова:

english

Файл:

PDF, 1.68 MB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Analysis of asperity dominated contacts in nanoelectromechanical relays using thin films

Harrison, Kimberly L., Dalvi, Chaitali, Asheghi, Mehdi, Howe, Roger T.

Рік:

2014

Мова:

english

Файл:

PDF, 465 KB

english, 2014

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - A reliability study with infrared imaging of thermoelectric modules under thermal cycling

Barako, Michael T., Woosung Park,, Marconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2012

Мова:

english

Файл:

PDF, 1.28 MB

english, 2012

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal characterization of nanostructured superlattices of TiN/TaN: Applications as electrodes in Phase Change Memory

Sood, Aditya, Eryilmaz, Sukru Burc, Jeyasingh, Rakesh, Jungwan Cho,, Asheghi, Mehdi, Wong, H.-S. Philip, Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 671 KB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Finite element thermal analysis of localized heating in AlGaN/GaN HEMT based sensors

Hou, Minmin, Chi-Chun Pan,, Asheghi, Mehdi, Senesky, Debbie G.

Рік:

2014

Мова:

english

Файл:

PDF, 619 KB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Anisotropic and nonhomogeneous thermal conduction in 1 µm thick CVD diamond

Sood, Aditya, Jungwan Cho,, Hobart, Karl D., Feygelson, Tatyana, Pate, Bradford, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 540 KB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Inverse opals for fluid delivery in electronics cooling systems

Dusseault, Thomas J., Gires, Julie, Barako, Michael T., Yoonjin Won,, Agonafer, Damena D., Asheghi, Mehdi, Santiago, Juan G., Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 1.43 MB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal conduction in nanoporous copper inverse opal films

Barako, Michael T., Weisse, Jeffrey M., Roy, Shilpi, Kodama, Takashi, Dusseault, Thomas J., Motoyama, Munekazu, Asheghi, Mehdi, Prinz, Fritz B., Xiaolin Zheng,, Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 2.03 MB

english, 2014

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications

Lingamneni, Srilakshmi, Asheghi, Mehdi, Goodson, Kenneth E.

Рік:

2014

Мова:

english

Файл:

PDF, 583 KB

english, 2014

[IEEE 2004 Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) - Grapevine, TX, USA (2004.09.19-2004.09.23)] 2004 Electrical Overstress/Electrostatic Discharge Symposium - Comparison of thermal response of GMR sensor subjected to HBM and CDM transients

Yang, Yizhang, Asheghi, Mehdi

Рік:

2004

Мова:

english

Файл:

PDF, 120 KB

english, 2004